TI's newest 300-millimeter wafer fab in Richardson, Texas, has started initial production and will ramp over the coming months to support the future growth of semiconductors in electronics. RFAB2 is connected to RFAB1, which opened in 2009 as the world’s first 300-mm analog wafer fab, and is one of six new 300-mm wafer fabs our company is adding to our manufacturing operations.
“We are thrilled to see initial production running through our newest and largest 300-mm wafer fab, which is part of our investment to expand internal manufacturing capacity for the long term,” said Kyle Flessner, senior vice president, Technology and Manufacturing Group. “This milestone is a result of close collaboration between our construction, facilities and manufacturing teams and we’re excited to ramp output over the coming months to support our customers’ demand for years to come.”